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The Hazardous Substances and Packaging (Legislative Functions and Amendment) (EU Exit) Regulations 2020

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Regulation 6

SCHEDULE 1Restriction of hazardous substances: applications for an exemption

1.  An application for an exemption, the renewal of an exemption, or the revocation of an exemption may be submitted by a manufacturer, the authorised representative of a manufacturer, or any economic operator in the supply chain.

2.  An application must include—

(a)the name, address and contact details of the applicant;

(b)information on the material or component and the specific uses of the substance in the material and component for which an exemption, or its renewal or revocation, is requested and its particular characteristics;

(c)verifiable and referenced justification for an exemption, or its renewal or revocation, in line with the conditions in regulation 5;

(d)an analysis of possible alternative substances, materials or designs, including, when available, information about independent research, peer-review studies and development activities by the applicant and an analysis of the availability of such alternatives;

(e)information on the possible preparation for reuse or recycling of materials from waste EEE, and on the appropriate treatment of waste;

(f)any other information held by or known to the applicant that is relevant to the application;

(g)the proposed actions to develop, request the development or apply possible alternatives, including a timetable for such actions by the applicant;

(h)where appropriate, an indication of the information which should be regarded as proprietary accompanied by verifiable justification;

(i)when applying for an exemption, a proposal for clear and precise wording for the exemption;

(j)a summary of the application.

3.  In paragraph 1, “authorised representative”, “economic operator” and “manufacturer” have the meanings given in regulation 2 of the 2012 Regulations.

Regulation 12

SCHEDULE 2Schedules A1 and A2 to the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012

Regulation 3

SCHEDULE A1Restricted substances referred to in regulation 3 and maximum concentration values tolerated by weight in homogeneous materials

  • Lead (0.1%)

  • Mercury (0.1%)

  • Cadmium (0.1%)

  • Hexavalent chromium (0.1%)

  • Polybrominated biphenyls (PBB) (0.1%)

  • Polybrominated diphenyl ethers (PBDE) (0.1%)

  • Bis (2-ethylexyl) phthalate (DEHP) (0.1%)

  • Butyl benzyl phthalate (BBP) (0.1%)

  • Dibutyl phthalate (DBP) (0.1%)

  • Diisobutyl phthalate (DIBP) (0.1%)

  • The restriction of DEHP, BBP, DBP and DIBP does not apply to—

    (a)

    medical devices, including in vitro medical devices;

    (b)

    monitoring and control instruments, including industrial monitoring and control instruments;

    (c)

    cables or spare parts for the repair, the reuse, the updating of functionalities or upgrading of capacity of EEE placed on the market before 22nd July 2019.

  • The restriction of DEHP, BBP and DBP does not apply to toys which are already subject to the restriction of DEHP, BBP and DBP through entry 51 of Annex 17 to Regulation (EC) No 1907/2006(1).

Regulation 3

SCHEDULE A2Applications exempted from the restriction in regulation 3(1)

The tables of exempted applications

1.  In this Schedule—

(a)Table 1 sets out exemptions from the restriction in regulation 3(1) for applications of restricted substances in EEE, other than exemptions for applications for spare parts for EEE;

(b)Table 2 sets out exemptions from the restriction in regulation 3(1) for applications of restricted substances in spare parts for EEE.

Interpretation of the tables

2.  The following provisions apply for the purposes of interpreting Tables 1 and 2.

3.  In Table 1, in the column headed “corresponding EU exemption”, a reference to a numbered Annex, followed by another number, is a reference to the exemption with that number in that Annex to Directive 2011/65/EU.

4.  In Tables 1 and 2, in the column headed “categories of EEE to which exemption applies”, the entries indicate the categories of EEE to which an exemption applies, as follows—

(a)a number from 1 to 11, which is not followed by any letters, means the category of EEE with that number in Part 1 of Schedule 1;

(b)“8iv” and “8x” are sub-categories of category 8 (medical devices) with the following meanings—

(i)8iv means in vitro diagnostic medical devices;

(ii)8x means medical devices, other than in vitro diagnostic medical devices;

(c)“9ind” and “9x” are sub-categories of category 9 (monitoring and control instruments) with the following meanings—

(i)9ind means industrial monitoring and control instruments;

(ii)9x means monitoring and control instruments, other than for industrial use.

5.  In Table 1, in the column headed “expiry date or status”—

(a)a date, in relation to an exemption and a category of EEE, is the expiry date of the exemption for that category of EEE, that is, the date on which the exemption expires subject to regulation 5(8) of the 2020 Regulations;

(b)“transitional case”, in relation to an exemption and a category of EEE, means that the exemption for that category of EEE is a transitional case for the purposes of regulation 10 of the 2020 Regulations.

6.  For the purposes of entries 1 to 9 in Table 1 (entries related to lighting) a lamp is for “general lighting purposes” if it is designed for the purpose of illuminating a room or space in order to provide or improve visibility, and it is for “special purposes” if it is designed for any other purpose.

7.  In paragraph 5, “the 2020 Regulations” means the Hazardous Substances and Packaging (Legislative Functions and Amendment) (EU Exit) Regulations 2020.

Table 1
Table of exempted applications
No.ApplicationMaximum quantity exempted (if any)Corresponding EU exemptionCategories of EEE to which exemption appliesExpiry date or status
(1)

OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81).

(2)

EUR 2016/1628.

1Mercury in single capped (compact) fluorescent lamps:
1.1For general lighting purposes < 30 W2.5 mg per burnerAnnex 3, 1(a)all categoriestransitional case
1.2For general lighting purposes ≥ 30 W and < 50 W3.5 mg per burnerAnnex 3, 1(b)all categoriestransitional case
1.3For general lighting purposes ≥ 50 W and < 150 W5 mg per burnerAnnex 3, 1(c)all categoriestransitional case
1.4For general lighting purposes ≥ 150 W15 mg per burnerAnnex 3, 1(d)all categoriestransitional case
1.5For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm7 mg per burnerAnnex 3, 1(e)all categoriestransitional case
1.6For special purposes5 mg per burnerAnnex 3, 1(f)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
1.7For general lighting purposes < 30 W with a lifetime equal or above 20,000 h3.5 mg per burnerAnnex 3, 1(g)all categoriestransitional case
2Mercury in double-capped linear fluorescent lamps for general lighting purposes:
2.1Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter < 9 mm (e.g. T2)4 mg per lampAnnex 3, 2(a)(1)all categoriestransitional case
2.2Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5)3 mg per lampAnnex 3, 2(a)(2)all categoriestransitional case
2.3Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8)3.5 mg per lamp

Annex 3, 2(a)(3)

all categoriestransitional case
2.4Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter > 28 mm (e.g. T12)3.5 mg per lampAnnex 3, 2(a)(4)all categoriestransitional case
2.5Tri-band phosphor with long lifetime (≥ 25,000 h)5 mg per lampAnnex 3, 2(a)(5)all categoriestransitional case
3Mercury in other fluorescent lamps:
3.1Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9).15 mg per lampAnnex 3, 2(b)(3)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
3.2Lamps for other general lighting and special purposes (e.g. induction lamps).15 mg per lampAnnex 3, 2(b)(4)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
4Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes:
4.1Short length (≤ 500 mm)3.5 mg per lampAnnex 3, 3(a)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
4.2Medium length (> 500 mm and ≤ 1500 mm)5 mg per lampAnnex 3, 3(b)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
4.3Long length (> 1500 mm)13 mg per lampAnnex 3, 3(c)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
5Mercury in other low pressure discharge lamps.15 mg per lampAnnex 3, 4(a)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
6Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes in lamps with improved colour rendering index Ra > 60:
6.1P ≤ 155 W30 mg per burnerAnnex 3, 4(b)-Iall categoriestransitional case
6.2155 W < P ≤ 405 W40 mg per burnerAnnex 3, 4(b)-IIall categoriestransitional case
6.3P > 405 W40 mg per burnerAnnex 3, 4(b)-IIIall categoriestransitional case
7Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes:
7.1P ≤ 155 W25 mg per burnerAnnex 3, 4(c)-Iall categoriestransitional case
7.2155 W < P ≤ 405 W30 mg per burnerAnnex 3, 4(c)-IIall categoriestransitional case
7.3P > 405 W40 mg per burnerAnnex 3, 4(c)-IIIall categoriestransitional case
8Mercury in metal halide lamps.Annex 3, 4(e)1–7, 10transitional case
8x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
9Mercury in other discharge lamps for special purposes not specifically mentioned in another entry in this Table.Annex 3, 4(f)1-7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
10Lead in glass of cathode ray tubes.Annex 3, 5(a)8x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
11Lead in glass of fluorescent tubes.0.2% lead by weightAnnex 3, 5(b)1–7, 10transitional case
8x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
12Lead as an alloying element in steel for machining purposes and in galvanised steel.0.35% lead by weightAnnex 3, 6(a)8, 9transitional case
1121st July 2024
13Lead as an alloying element in steel for machining purposes.0.35% lead by weightAnnex 3, 6(a)-I1-7, 10transitional case
14Lead as an alloying element in batch hot dip galvanised steel components.0.2% lead by weightAnnex 3, 6(a)-I1-7, 10transitional case
15Lead as an alloying element in aluminium.0.4% lead by weightAnnex 3, 6(b)8, 9transitional case
1121st July 2024
16Lead as an alloying element in aluminium, provided it stems from lead-bearing aluminium scrap recycling.0.4% lead by weightAnnex 3, 6(b)-I1-7, 10transitional case
17Lead as an alloying element in aluminium for machining purposes.0.4% lead by weightAnnex 3, 6(b)-II1-7, 10transitional case
18Copper alloy containing lead.4% lead by weightAnnex 3, 6(c)1-10transitional case
1121st July 2024
19

Lead in high melting temperature type solders, i.e. lead-based alloys containing 85% by weight or more lead.

This entry does not apply to applications covered by entry 42.

Annex 3, 7(a)1-10transitional case
1121st July 2024
20Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications.Annex 3, 7(b)8x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
21

Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.

This entry does not apply to applications covered by entry 49.

Annex 3, 7(c)-I1-10transitional case
1121st July 2024
22

Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher.

This entry does not apply to applications covered by entry 21 or 23.

Annex 3, 7(c)-II1 – 10transitional case
1121st July 2024
23Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors.Annex 3, 7(c)-IV1-7, 8x, 9x, 1021st July 2021
8iv21st July 2023
9ind, 1121st July 2024
24Cadmium and its compounds in electrical contacts.Annex 3, 8(b)8, 9transitional case
1121st July 2024
25

Cadmium and its compounds in electrical contacts used in:

— circuit breakers,

— thermal sensing controls,

— thermal motor protectors (excluding hermetic thermal motor protectors),

— AC switches rated at:

(a)

6 A and more at 250 V AC and more, or

(b)

12 A and more at 125 V AC and more,

— DC switches rated at 20 A and more at 18 V DC and more, and

— switches for use at voltage supply frequency ≥ 200 Hz.

Annex 3, 8(b)-I1-7, 10transitional case
26Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75 % by weight in the cooling solution.Annex 3, 98x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
27Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications.Annex 3, 9(b)8x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
28Lead in white glasses used for optical applications.Annex 3, 13(a)all categoriestransitional case
29Cadmium and lead in filter glasses and glasses used for reflectance standards.Annex 3, 13(b)8, 9, 11transitional case
30Lead in ion coloured optical filter glass types.Annex 3, 13(b)-(I)1-7, 10transitional case
31Cadmium in striking optical filter glass types.Annex 3, 13(b)-(II)1-7, 10transitional case
32Cadmium and lead in glazes used for reflectance standards.Annex 3, 13(b)-(III)1-7, 10transitional case
33Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.Annex 3, 158, 9transitional case
1121st July 2024
34

Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:

— a semiconductor technology node of 90 nm or larger;

— a single die of 300 mm² or larger in any semi-conductor technology node;

— stacked die packages with die of 300 mm² or larger, or silicon interposers of 300mm2 or larger.

Annex 3, 15(a)1–7, 10transitional case
35Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications.Annex 3, 178x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
36Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi2O5:Pb) when used as sun tanning lamps.1% lead by weight or lessAnnex 3, 18(b)1–7, 8x, 9x, 10transitional case
8iv21st July 2023
9ind, 1121st July 2024
37

Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi2O5:Pb) when used in medical phototherapy equipment.

This entry does not apply to applications covered by entry 88.

1% lead by weight or lessAnnex 3, 18(b)-I5, 8transitional case
38Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses.Annex 3, 218x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
39Cadmium when used in colour printed glass to provide filtering functions, used as a component in lighting applications installed in displays and control panels of EEE.Annex 3, 21(a)1–7, 1021st July 2021
40Cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses.Annex 3, 21(b)1–7, 1021st July 2021
41Lead in printing inks for the application of enamels on other than borosilicate glasses.Annex 3, 21(c)1–7, 1021st July 2021
42Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.Annex 3, 241–10transitional case
1121st July 2024
43Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring.Annex 3, 258x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
44Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC(1).Annex 3, 291–7, 10, 11transitional case
8x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
45Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.Annex 3, 308x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
46Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).Annex 3, 318x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
47Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.Annex 3, 321–7, 8x, 9, 10transitional case
8iv21st July 2023
1121st July 2024
48Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers.Annex 3, 338x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
49Lead in cermet-based trimmer potentiometer elements.Annex 3, 341–10transitional case
1121st July 2024
50Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.Annex 3, 371–7, 8x, 9x, 1021st July 2021
8iv21st July 2023
9ind, 1121st July 2024
51Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.Annex 3, 388x, 9x21st July 2021
8iv21st July 2023
9ind, 1121st July 2024
52Cadmium selenide in downshifting cadmium-based semiconductor nanocrystal quantum dots for use in display lighting applications (< 0.2 μg Cd per mm² of display screen area).Annex 3, 39(a)all categoriestransitional case
53Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (category NRSh in Regulation (EU) 2016/1628 of the European Parliament and of the Council(2)).Annex 3, 411–7, 10, 1131st March 2022
8x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
54

Lead in bearings and bushes of diesel or gaseous fuel powered internal combustion engines applied in non-road professional use equipment:

— with engine total displacement ≥ 15 litres; or

— with engine total displacement < 15 litres and the engine is designed to operate in applications where the time between signal to start and full load is required to be less than 10 seconds; or regular maintenance is typically performed in a harsh and dirty outdoor environment, such as mining, construction, and agriculture applications.

This entry does not apply to applications covered by entry 18.

Annex 3, 428x, 9xtransitional case
1121st July 2024
55

Bis(2-ethylhexyl) phthalate in rubber components in engine systems, designed for use in equipment that is not intended solely for consumer use and provided that no plasticised material comes into contact with human mucous membranes or into prolonged contact with human skin.

This entry applies where the concentration value of bis(2-ethylhexyl) phthalate does not exceed:

30 % by weight of the rubber for:

gasket coatings;

solid-rubber gaskets; or

rubber components included in assemblies of at least three components using electrical, mechanical or hydraulic energy to do work, and attached to the engine.

10% by weight of the rubber for rubber-containing components not referred to in point (a).

For the purposes of this entry, ‘prolonged contact with human skin’ means continuous contact of more than 10 minutes duration or intermittent contact over a period of 30 minutes, per day.

Annex 3, 439ind15th July 2023
1121st July 2024
56Lead in solder of sensors, actuators, and engine control units of combustion engines within the scope of Regulation (EU) 2016/1628 of the European Parliament and of the Council, installed in equipment used at fixed positions while in operation which is designed for professionals, but also used by non-professional users.Annex 3, 441121st July 2024
57Lead, cadmium and mercury in detectors for ionising radiation.Annex 4, 18x, 9x, 9indtransitional case
8iv21st July 2023
58Lead bearings in X-ray tubes.Annex 4, 28x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
59

Lead in electromagnetic radiation amplification devices:

micro-channel plate and capillary plate.

Annex 4, 38, 9transitional case
60Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons.Annex 4, 48x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
61Lead in shielding for ionising radiation.Annex 4, 58x, 9transitional case
8iv21st July 2023
62Lead in X-ray test objects.Annex 4, 68x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
63Lead stearate X-ray diffraction crystals.Annex 4, 78x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
64Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers.Annex 4, 88x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
65Lead and cadmium in ion selective electrodes including glass of pH electrodes.Annex 4, 1a8x, 9transitional case
8iv21st July 2023
66Lead anodes in electrochemical oxygen sensors.Annex 4, 1b8x, 9transitional case
8iv21st July 2023
67Lead, cadmium and mercury in infra-red light detectors.Annex 4, 1c8, 9transitional case
68Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide.Annex 4, 1d8x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
69Cadmium in helium-cadmium lasers.Annex 4, 98x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
70Lead and cadmium in atomic absorption spectroscopy lamps.Annex 4, 108x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
71Lead in alloys as a superconductor and thermal conductor in MRI.Annex 4, 118x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
72Lead and cadmium in metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors.Annex 4, 128x, 9transitional case
8iv30th June 2021
73Lead in counterweights.Annex 4, 138x, 9xtransitional case
38iv21st July 2023
9ind21st July 2024
74Lead in single crystal piezoelectric materials for ultrasonic transducers.Annex 4, 148x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
75Lead in solders for bonding to ultrasonic transducers.Annex 4, 158x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
76Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments.20mg of mercury per switch or relayAnnex 4, 168x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
77Lead in solders in portable emergency defibrillators.Annex 4, 178x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
78Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μm.Annex 4, 188x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
79Lead in liquid crystal on silicon (LCoS) displays.Annex 4, 198x, 9x21st July 2021
8iv21st July 2023
9ind21st July 2024
80Cadmium in X-ray measurement filters.Annex 4, 208x, 9xtransitional case
8iv21st July 2023
9ind21st July 2024
81Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy equipment.Annex 4, 228, 930th June 2021
82Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation.Annex 4, 238, 930th June 2021
83Lead in the surface coatings of pin connector systems. requiring nonmagnetic connectors which are used durably at a temperature below –20 °C under normal operating and storage conditions.Annex 4, 258, 930th June 2021
84

Lead in the following applications that are used durably at a temperature below –20 °C under normal operating and storage conditions:

(c)

solders on printed circuit boards;

(d)

termination coatings of electrical and electronic components and coatings of printed circuit boards;

(e)

solders for connecting wires and cables;

(f)

solders connecting transducers and sensors.

Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below –150 °C.

Annex 4, 268x, 9transitional case
8iv30th June 2021
85

Lead in:

— solders,

— termination coatings of electrical and electronic components and printed circuit boards,

— connections of electrical wires, shields and enclosed connectors,

which are used in:

(g)

magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, or

(h)

magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy.

Annex 4, 278, 9xtransitional case
86Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices or in industrial monitoring and control instruments.Annex 4, 298xtransitional case
8iv, 9ind30th June 2021
87Lead, cadmium, hexavalent chromium, and polybrominated diphenyl ethers (PBDE) in spare parts recovered from and used for the repair or refurbishment of medical devices, including in vitro diagnostic medical devices, or electron microscopes and their accessories, provided that the reuse takes place in auditable closed-loop business-to-business return systems and that each reuse of parts is notified to the customer.Annex 4, 31a8, 9xtransitional case
9ind21st July 2024
88Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi2O5:Pb) phosphors.Annex 4, 348, 922nd July 2021
89Mercury in cold cathode fluorescent lamps for back-lighting liquid crystal displays, not exceeding 5 mg per lamp, used in industrial monitoring and control instruments placed on the market before 22 July 2017.Annex 4, 359ind21st July 2024
90

Lead in platinized platinum electrodes used for conductivity measurements where at least one of the following conditions applies:

(i)

wide-range measurements with a conductivity range covering more than 1 order of magnitude (e.g. range between 0.1 mS/m and 5 mS/m) in laboratory applications for unknown concentrations;

(j)

measurements of solutions where an accuracy of +/– 1 % of the sample range and where high corrosion resistance of the electrode are required for any of the following:

(i)

solutions with an acidity < pH 1;

(ii)

solutions with an alkalinity > pH 13;

(iii)

corrosive solutions containing halogen gas;

(k)

measurements of conductivities above 100 mS/m that must be performed with portable instruments.

Annex 4, 378, 931st December 2025
91

Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:

(l)

a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;

(m)

a two-dimensional spatial resolution for detecting electrons or ions, where at least one of the following applies:

(i)

a response time shorter than 25 ns;

(ii)

a sample detection area larger than 149 mm² ;

(iii)

a multiplication factor larger than 1.3 × 10³ .

(n)

a response time shorter than 5 ns for detecting electrons or ions;

(o)

a sample detection area larger than 314 mm² for detecting electrons or ions;

(p)

a multiplication factor larger than 4.0 × 107.

Annex 4, 398, 9transitional case
92Lead as a thermal stabiliser in polyvinyl chloride (PVC) used as base material in amperometric, potentiometric and conductometric electrochemical sensors which are used in in-vitro diagnostic medical devices for the analysis of blood and other body fluids and body gases.Annex 4, 418iv31st March 2022
93Mercury in electric rotating connectors used in intravascular ultrasound imaging systems capable of high operating frequency (> 50 MHz) modes of operation.Annex 4, 428x, 9xtransitional case
94Cadmium anodes in Hersch cells for oxygen sensors used in industrial monitoring and control instruments, where sensitivity below 10 ppm is required.Annex 4, 439ind15th July 2023
95Cadmium in radiation tolerant video camera tubes designed for cameras with a centre resolution greater than 450 TV lines which are used in environments with ionising radiation exposure exceeding 100 Gy/hour and a total dose in excess of 100kGy.Annex 4, 448x, 9

31st March 2027

Table 2
Table of exemptions for spare parts for EEE with no expiry date
No.ApplicationCategories of EEE to which exemption applies
1Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC, where used in spare parts for EEE placed on the market before 1st January 2013.all categories
2Cadmium and its compounds in one shot pellet type thermal cut-offs, where used in spare parts for EEE placed on the market before 1st January 2012.all categories
3Lead used in C-press compliant pin connector systems, where used in spare parts for EEE placed on the market before 24th September 2010.all categories
4Lead used in other than C-press compliant pin connector systems, where used in spare parts for EEE placed on the market before 1st January 2013.all categories
5Lead as a coating material for the thermal conduction module C-ring, where used in spare parts for EEE placed on the market before 24th September 2010.all categories
6Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight, where used in spare parts for EEE placed on the market before 1st January 2011.all categories
7Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less, where used in spare parts for EEE placed on the market before 24th September 2010.all categories
8Cadmium in phosphor coatings in image intensifiers for X-ray images, in spare parts for X-ray systems placed on the market before 1st January 2020.8, 9
9Hexavalent chromium in alkali dispensers used to create photocathodes in X-ray image intensifiers, where used in spare parts for X-ray systems placed on the market before 1st January 2020.8, 9
10Lead used in other than C-press compliant pin connector systems, where used in spare parts for industrial monitoring and control instruments placed on the market before 1st January 2021.9ind
11Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC, where used in spare parts for industrial monitoring and control instruments placed on the market before 1st January 2021.9ind
(1)

EUR 2006/1907.

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