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2E—2E001 Technology required for the development of goods specified in sub-categories 2A, 2B or 2D.
2E002 Technology required for the production of goods specified in sub-categories 2A or 2B.
2E003 Other technology, as follows:
a.Technology:
1.For the development of interactive graphics as an integrated part in numerical control units for preparation or modification of part programmes;
2.For the development of generators of machine tool instructions (e.g., part programmes) from design data residing inside numerical control units;
3.For the development of integration software for incorporation of expert systems for advanced decision support of shop floor operations into numerical control units;
b.Technology for metal-working manufacturing processes, as follows:
1.Technology for the design of tools, dies or fixtures specially designed for the following processes:
a.Superplastic forming;
b.Diffusion bonding;
c.Direct-acting hydraulic pressing;
2.Technical data consisting of process methods or parameters as listed below used to control:
a.Superplastic forming of aluminium alloys, titanium alloys or superalloys:
1.Surface preparation;
2.Strain rate;
3.Temperature;
4.Pressure;
b.Diffusion bonding of superalloys or titanium alloys:
1.Surface preparation;
2.Temperature;
3.Pressure;
c.Direct-acting hydraulic pressing of aluminium alloys or titanium alloys:
1.Pressure;
2.Cycle time;
d.Hot isostatic densification of titanium alloys, aluminium alloys or superalloys:
1.Temperature;
2.Pressure;
3.Cycle time;
c.Technology for the development or production of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;
d.Technology for:
The application of inorganic overlay coatings or inorganic surface modification coatings, specified in column 3 of the following Table;
To non-elecronic substrates, specified in column 2 of the following Table; By processes specified in column 1 of the following Table and defined in the Note.
1 Coating Process (1)a | 2 Substrate | 3 Resultant Coating |
---|---|---|
a (The numbers in parenthesis refer to the Notes following this Table.) | ||
A. Chemical Vapour Deposition (CVD) | Superalloys | Aluminides for internal passages |
Ceramics and low-expansion glasses(14) | Silicides | |
Carbides | ||
Dielectric layers (15) | ||
Carbon-carbon, ceramic and metal matrix composites | Silicides | |
Carbides | ||
Refractory metals | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Aluminides | ||
Alloyed aluminides (2) | ||
Cemented tungsten carbide (16), silicon carbide | Carbides | |
Tungsten | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Molybdenum and molybdenum alloys | Dielectric layers (15) | |
Beryllium and beryllium alloys | Dielectric layers (15) | |
Sensor window materials (9) | Dielectric layers (15) | |
B. Thermal-Evaporation Physical Vapour Deposition (TE-PVD) | ||
1.Physical Vapour Deposition (PVD): Electron-Beam (EB-PVD) | Superalloys | Alloyed silicides |
Alloyed aluminides (2) | ||
MCrA1X (5) | ||
Modified zirconia (12) | ||
Silicides | ||
Aluminides | ||
Mixtures thereof (4) | ||
Ceramics and low-expansion glasses (14) | Dielectric layers (15) | |
Corrosion resistant steel (7) | MCrA1X (5) | |
Modified zirconia (12) | ||
Mixtures thereof (4) | ||
Carbon-carbon, ceramic and metal matrix composites | Silicides | |
Carbides | ||
Refractory metals | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Cemented tungsten carbide (16), silicon carbide | Carbides | |
Tungsten | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Molybdenum and molybdenum alloys | Dielectric layers (15) | |
Beryllium and beryllium alloys | Dielectric layers (15) | |
Borides | ||
Sensor window materials (9) | Dielectric layers (15) | |
Titanium alloys (13) | Borides | |
Nitrides | ||
B.2.Ion assisted resistive heating Physical Vapour Deposition (Ion Plating) | Ceramics and low-expansion glasses (14) | Dielectric layers (15) |
Carbon-carbon, ceramic and metal matrix composites | Dielectric layers (15) | |
Cemented tungsten carbide (16), silicon carbide | Dielectric layers (15) | |
Molybdenum and molybdenum alloys | Dielectric layers (15) | |
Beryllium and beryllium alloys | Dielectric layers (15) | |
Sensor window materials (9) | Dielectric layers (15) | |
B.3.Physical Vapour Deposition: laser evaporation | Ceramics and low-expansion glasses (14) | Silicides |
Dielectric layers (15) | ||
Carbon-carbon, ceramic and metal matrix composites | Dielectric layers (15) | |
Cemented tungsten carbide (16), silicon carbide | Dielectric layers (15) | |
Molybdenum and molybdenum alloys | Dielectric layers (15) | |
Beryllium and beryllium alloys | Dielectric layers (15) | |
Sensor window materials (9) | Dielectric layers (15) | |
Diamond-like carbon | ||
B.4.Physical Vapour Deposition: cathodic arc discharge | Superalloys | Alloyed silicides |
Alloyed aluminides (2) | ||
MCrA1X (5) | ||
Polymers (11) and organic matrix composites | Borides | |
Carbides | ||
Nitrides | ||
C.Pack cementation (see A above for out-of-pack cementation) (10) | Carbon-carbon, ceramic and metal matrix composites | Silicides |
Carbides | ||
Mixtures thereof (4) | ||
Titanium alloys (13) | Silicides | |
Aluminides | ||
Alloyed aluminides (2) | ||
Refractory metals and alloys (8) | Silicides | |
Oxides | ||
D. Plasma spraying | Superalloys | MCrA1X (5) |
Modified zirconia (12) | ||
Mixtures thereof (4) | ||
Abradable Nickel-Graphite | ||
Abradable Ni-Cr-Al-Bentonite | ||
Abradable Al-Si-Polyester | ||
Alloyed aluminides (2) | ||
Aluminium alloys (6) | MCrA1X (5) | |
Modified zirconia (12) | ||
Silicides | ||
Mixtures thereof (4) | ||
Refractory metals and alloys (8) | Aluminides | |
Silicides | ||
Carbides | ||
Corrosion resistant steel (7) | Modified zirconia (12) | |
Mixtures thereof (4) | ||
Titanium alloys (13) | Carbides | |
Aluminides | ||
Silicides | ||
Alloyed aluminides (2) | ||
Abradable Nickel-Graphite | ||
Abradable Ni-Cr-Al-Bentonite | ||
Abradable Al-Si-Polyester | ||
E. Slurry Deposition | Refractory metals and alloys (8) | Fused silicides |
Fused aluminides except for resistance heating elements | ||
Carbon-carbon, ceramic and metal matrix composites | Silicides | |
Carbides | ||
Mixtures thereof (4) | ||
F. Sputter Deposition | Superalloys | Alloyed silicides |
Alloyed aluminides (2) | ||
Noble metal modified aluminides (3) | ||
MCrA1X (5) | ||
Modified zirconia (12) | ||
Platinum | ||
Mixtures thereof (4) | ||
Ceramics and low-expansion glasses (14) | Silicides | |
Platinum | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Titanium alloys (13) | Borides | |
Nitrides | ||
Oxides | ||
Silicides | ||
Aluminides | ||
Alloyed aluminides (2) | ||
Carbides | ||
Carbon-carbon, ceramic and metal matrix composites | Silicides | |
Carbides | ||
Refractory metals | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Cemented tungsten carbide (16), silicon carbide | Carbides | |
Tungsten | ||
Mixtures thereof (4) | ||
Dielectric layers (15) | ||
Molybdenum and molybdenum alloys | Dielectric layers (15) | |
Beryllium and beryllium alloys | Borides | |
Sensor window materials (9) | Dielectric layers (15) | |
Dielectric layers (15) | ||
Refractory metals and alloys (8) | Aluminides | |
Silicides | ||
Oxides | ||
Carbides | ||
G. Ion Implantation | High temperature bearing steels | Additions of chromium, tantalum or niobium (columbium) |
Titanium alloys (13) | Borides | |
Nitrides | ||
Beryllium and beryllium alloys | Borides | |
Cemented tungsten carbide(16) | Carbides | |
Nitrides |
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