The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2006

Regulation 4

SCHEDULE 1 Categories of electrical and electronic equipment

1.  Large household appliances.

2.  Small household appliances.

3.  IT and telecommunications equipment.

4.  Consumer equipment.

5.  Lighting equipment.

6.  Electrical and electronic tools (with the exception of large-scale stationary industrial tools).

7.  Toys, leisure and sports equipment.

8.  Automatic dispensers.

Regulation 5(2)

SCHEDULE 2 Exempt applications

1.  Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

2.  Mercury in straight fluorescent lamps for general purposes not exceeding

(a) 10 mg for halophosphate lamps,

(b) 5mg for triphosphate lamps with normal lifetime, and

(c) 8 mg for triphosphate lamps with long lifetime.

3.  Mercury in straight fluorescent lamps for special purposes.

4.  Mercury in other lamps not specifically mentioned in this schedule.

5.  Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

6.  Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.

7.  Lead—

(a) in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead),

(b) in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, and

(c) in electronic ceramic parts (e.g. piezoelectronic devices).

8.  Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC(1) amending Directive 76/769/EEC(2) relating to restrictions on the marketing and use of certain dangerous substances and preparations.

9.  Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.

10.  DecaBDE in polymeric applications.

11.  Lead in lead-bronze bearing shells and bushes.

12.  Lead used in compliant pin connector systems.

13.  Lead as a coating material for the thermal conduction module c-ring.

14.  Lead and cadmium in optical and filter glass.

15.  Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.

16.  Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

17.  Lead in linear incandescent lamps with silicate coated tubes.

18.  Lead halide as radiant agent in High Density Discharge lamps used for professional reprography applications.

19.  Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi₂O₅:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)₂MgSi₂O₇:Pb).

20.  Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps.

21.  Lead oxide in glass used for bonding front and rear substances of flat fluorescent lamps used for Liquid Crystal Displays.

(1)

OJ No. L186, 12.7.91, p.59.

(2)

OJ No. L262, 27.9.76, p.201.