Sector | Matters |
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(1) Advanced composites | 1The matters are, in relation to the sector of advanced composites, those set out in paragraphs 2 to 4. 2In relation to test, inspection and production equipment— aproduction technologies and capabilities for the manufacture of metal matrix composites; bproduction technologies and capabilities for the manufacture of ceramic matrix composites; cmanufacture of 3D fibre architectures (that is with interlaminar reinforcement) for all composite types. 3In relation to materials— ametal matrix composites, powder-based metal matrix composites and continuous fibre reinforced metal matrix composites; bfibre reinforced ceramic matrix composites; ccontinuous silicon carbide fibres with diameters at and below 140 micrometres; dcontinuous oxide-based ceramic fibres with diameters at or below 20 micrometres; ecoatings for the protection of ceramic matrix composites from degradation in the environment, for example ytterbium mono- and di-silicates; 4In relation to software and data— acapabilities for the design and design for manufacturing of metal matrix composites and fibre reinforced ceramic matrix composites; bsoftware and computer-aided design for 3D fibre architectures and 3D preforms (with interlaminar reinforcement) for all composite types.
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(2) Metals and alloys | 1The matters are, in relation to the sector of metal and alloys, those set out in paragraphs 2 to 5. 2In relation to systems, equipment and components, magnets utilising rare earth element-lean or element-free permanent magnetic materials with remanent magnetism, known as “Br”, greater than 1.0 Tesla and all rare-earth magnetic materials; 3In relation to testing, inspection and production equipment— aany processes that are involved in the reduction of either pure or mixed oxides in the solid state into either metals or alloys in or into crude or semi-fabricated forms, including powders, in batches of at least 1 kilogram; bhot isostatic pressing (also referred to as “HIP”); cspark plasma sintering (also referred to as “SPS”) or field assisted sintering technology (also referred to as “FAST”); ddiffusion and friction-based joining processes for steel for power transmission shafts described in paragraph 4(e) of this sector (metal and alloys), titanium alloys, nickel alloys or cobalt alloys; efriction-based processes to join metallic material layer by layer to create a structure; fsuperplastic forming of titanium and aluminium alloys; gelectron beam, laser and weld arc-based metal additive manufacturing capabilities. 4In relation to materials— aany alloys that are formed by chemical or electrochemical reduction of feedstocks in the solid state directly from their oxides; btitanium alloys with continuous temperature-of-use capabilities above 350 Celsius; cpowder metallurgy alloys; dnickel and cobalt based superalloys with continuous temperature-of-use capabilities above 700 Celsius; esteels for power transmission shafts with yield strengths of at least 1030 megapascals at 20 Celsius and 760 megapascals at 450 Celsius, ultimate tensile strengths of at least 1240 MPa at 20 Celsius and 950 megapascals at 450 Celsius and fracture toughnesses of at least 40 megapascals square root metres at 20 Celsius; fhigh strength high toughness weldable marine grade steels (toughness levels D, E and F); harmour grade aluminium alloys; ihigh entropy alloys and compositionally complex alloys (alloys that are formed by five or more elements where the composition is not dominated by one or two elements); jrare earth element-lean or element-free permanent magnetic materials with remanent magnetisation (also known as “Br”), greater than 1.0 Tesla, and all rare-earth magnetic materials; kmagnetic materials with high total saturation flux densities greater than 2.0 Tesla, which may include monolithic and laminate forms, and particulate and fibre reinforced composite materials. 5In relation to software and data— acomputer models of complex metallic components, formed by powder-based additive manufacture, that embody a fluid and heat transfer function within their structure; bdata on the performance of complex metallic components, formed by powder-based additive manufacture, that embody a fluid and heat transfer function within their structure.
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(3) Engineering and technical polymers | 1The matters are, in relation to engineering and technical polymers, those set out in paragraphs 2 and 3. 2In relation to test, inspection and production equipment, machines for additively manufacturing the materials listed in paragraph 3 of this sector (Engineering and technical polymers), including loaded polymer filaments to enable electrically insulating and electrically conducting, thermally conducting and insulating, or magnetic and non-magnetic materials (or any further combination). 3In relation to materials— aengineering polymer materials and formulations with a glass transition temperature greater than 190 Celsius; bpolymers responsive to external stimuli such as electromagnetic, load, chemical and biological stimuli (for example electroactive polymers, thermoactive polymers and self-healing systems) but not hydrogels in applications such as nappies; chigh temperature, high pressure and chemically resistant elastomeric seals and systems; dpolymer electrical insulation materials with high temperature (greater than 200 Celsius) and high voltage (above 1kilovolt)) capabilities for application in aviation electrical power management systems; efilaments and feedstocks for additive manufacturing or 3D printing with bespoke and elevated electrical, magnetic, or electromagnetic properties (typically formed from filled polymer compositions); fadhesives capable of retaining performance at high temperatures (above 190 Celsius); gadhesives with underwater curing capabilities; hvoid-filling viscoelastic polymers, created using at least a thermoplastic polyester and curing agent, intended for use to damp vibrations in metallic structures.
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(4) Engineering and technical ceramics | 1The matters are, in relation to engineering and technical ceramics, those set out in paragraphs 2 and 3. 2In relation to test, inspection and production equipment, spark plasma sintering or field assisted sintering technology. 3In relation to materials— aboron carbide and silicon carbide ceramics for the manufacture of hard armour plates; bultra-high temperature ceramics (with melting temperatures of at least 3000 Celsius) including transition metal diborides, either as monolithic or composite forms, including other ceramic monoliths or composites where ultra-high temperature ceramics have been added to their bulk or into surfaces; cmagnetic materials, including fibres and particulates, for electromagnetic applications at frequencies above 500 megahertz; dfunctional ceramics (including ferroelectrics, magneto-dielectrics, or multi-ferroics) for acoustic applications, or electromagnetic applications above 100 megahertz; edielectric and ferroelectric materials for use in the generation of, and manipulation of, high energy or high power radio frequency radiation, including functioning under high voltage conditions.
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(5) Technical textiles | 1The matters are, in relation to technical textiles, those set out in paragraphs 2 to 6. 2In relation to systems, equipment and components, textile materials and products manufactured primarily for technical performance and functional properties rather than aesthetic or decorative characteristics but not sportswear or clothing ordinarily available to consumers or household goods; 3In relation to test, inspection and production equipment— aknitting, weaving, nonwoven or hybrid manufacturing processes related to the textile materials and products described in paragraph 2 of this sector; bfibre manufacturing processes related to the textile materials and products described in paragraph 2 of this sector (Technical textiles); cyarn manufacturing and texturing, dry fabric coating and laminating; dmanufacture of 3D textiles; eclosed loop recycling processes associated with the textile materials and products described in paragraph 2 of this sector. 4In relation to materials— asmart fabrics with fibres or yarns equipped with embedded sensors that respond to stimuli and perform a specific function; bfabrics made of smart polymers and textiles to protect and prevent injury or damage from blast and ballistic events; cenergy harvesting fabrics; dtextiles or fibres incorporating activated carbon; efabrics with embedded devices for data storage and communication. 5In relation to software and data— asoftware and computer-aided design for 3D textiles and preforms; bmachine learning software systems for smart textile manufacturing facilities, or for data-driven design and manufacturing of textile materials and systems. 6In relation to technology— atextile-based wearable electronics with potential to enable subtle integration of electronics with the human body for human-machine interfacing; bintegration technologies to enable functionalities such as energy harvesting, data storage and communication, camouflage, structural and personnel health monitoring and protection.
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(6) Metamaterials | 1The matters are, in relation to metamaterials, those set out in paragraphs 2 to 6. 2In relation to systems, equipment and components, metamaterials used in— aelectromagnetic components including antennas, arrays, lens, devices; belectromagnetic applications including radio frequencies and microwave through to ultraviolet wavelengths; cnano-photonics or quantum technology as an enabler; dthermal control or protection; eairborne or underwater acoustics; or 3In relation to test, inspection and production equipment— atest, inspection and production equipment associated with the fabrication of 2D and 3D arrangements of one or more material and/or device constituents to form a metamaterial (including additive manufacturing, printed electronics methods, nano-fabrication, chemical self-assembly or engineering biology); bequipment associated with the non-destructive test and assurance of assembled or produced metamaterial, including composition, spatially varying composition and spatial arrangement parameters. 4In relation to materials— btailored or bespoke feedstocks used in fabricating metamaterials including blended or formulated filaments referred to in paragraph 3(e) of sector (3) (engineering and technical polymers)), inks or dispersions used for additive manufacturing or printing but excluding inks or dispersions commercialised for forming electrically conducting pathways (known as “wires”) in printed electronics. 5In relation to software and data, accumulations of metamaterial designs, or of elements comprising metamaterials, any of which that enable artificial intelligence, machine learning design or optimisation of metamaterials. 6In relation to technology, the inclusion with a metamaterial of technology in the form of systems or components, as well as material constituents, as part of the means and methods that enable metamaterials to alter their function and behaviour once installed or produced.
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(7) Semiconductors | 1The matters are, in relation to semiconductors, those set out in paragraphs 2 to 5. 2In relation to systems, equipment and components— ahigh performance thermal imaging systems, equipment and components providing system sensitivity less than 30 milli-Kelvin for large format systems with more than 1 megapixels; bintegrated systems having multiple operating wavebands on a single camera including mid-wavelength and long-wavelength infrared; cimaging systems with on-chip (smart) processing; dtype II superlattice detectors; esingle photon counting detector arrays operating at wavelengths longer than the visible band (wavelength greater than 750 nanometres), and with a size of at least 32x32 elements, or linear arrays with a size of at least 1x256 elements; flow noise CMOS (complementary metal-oxide-semiconductor) and EMCCD (electron multiplying charge coupled device) cameras where low noise would be less than 1 photoelectron/pixel/second; gtechnology and components for non-Von Neumann computing architectures, including but not limited to neuromorphic computing systems. 3In relation to test, inspection and production equipment— athe production of radio and microwave frequency systems, equipment and components incorporating compound semiconductors; example components include but are not limited to control circuitry, power amplifiers, low noise amplifiers and monolithic microwave integrated circuits, detectors and photonic devices; bfacilities operating as a compound semiconductor foundry or providing compound semiconductor processing capability; cchip and device fabrication; dceramic and polymeric packaging of processed semiconductor chips; ethe production and integration capabilities for the high-performance imaging systems described in paragraph 2 of this sector (semiconductors). 4In relation to materials— aall compound semiconductors for radio frequency and microwave application including gallium nitride, gallium arsenide, gallium oxide, silicon germanium and indium phosphide; bimaging camera detector materials including cadmium mercury telluride, aluminium gallium arsenide, indium gallium arsenide and germanium silicon. 5In relation to software and data, chip and device design.
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(8) Photonic and optoelectronic materials and devices | 1The matters are, in relation to photonic and optoelectronic materials and devices, those set out in paragraphs 2 to 6. 2In relation to systems, equipment and components— apolarisation control components including materials (solid and liquid) especially for high power applications (greater than 100 watts); boptical fibre designs mitigating nonlinear effects and enabling polarisation control of the output light for high power applications in both transverse single-mode and multimode optical fibre formats; coptical fibre based components such as light diodes, tap couplers and fibre Bragg gratings; dnonlinear components for nonlinear frequency conversion such as optical fibre geometries, crystal materials and optical patterning techniques; elow loss, high bandwidth optical fibre technologies (for laser sources and amplifier stages) and manufacturing techniques where the output power is capable of being scaled up for lasers that meet the characteristics set out in the description of “photonic and optoelectronic material and devices” in paragraph 1 of this Schedule (Interpretation); fphase modulators, where the spectral linewidth of fibre laser amplifiers is limited to no more than 16 gigahertz. 3In relation to test, inspection and production equipment— aoptical fibre designs and production techniques, including coating techniques and test methodologies; blaser materials manufacturing techniques, host material doping techniques and characterisation techniques. 4In relation to materials— amaterials that enable increased amplification, improved quality, improved robustness, improved increased electro-optical efficiency or reduced size or volume; bmaterials and or coatings or treatments that reduce optical losses of lenses or mirrors; cmaterials and or coatings or treatments that improve or increase the physical stability or robustness of lenses or mirrors; dmaterials enabling non-mechanical beam steering for detectors, sensors and imaging systems; ematerials that reduce the size, weight and power requirements of optical detection, sensing and imaging systems; fmaterials suitable for aberration correction of high-power lasers (greater than 1 kilowatt) in the atmosphere. 5In relation to software and data— aalgorithms, and their implementation in firmware, that compensate for the adverse atmospheric effects on laser beam propagation at distances greater than1 kilometre; bsoftware, hardware and algorithm developments that improve phase control/coherent beam combination and efficiency. 6In relation to technology— aany approaches that enable high average optical power (greater than 3 kilowatts) combined with high quality (M2 <1.2) amplifiers; bany aspects that enable the propagation of light over significant distances (greater than 1 kilometre), including aberration correction devices.
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(9) Graphene and related 2D materials | 1The matters are, in relation to graphene and related 2D materials, those set out in paragraphs 2 to 5. 2In relation to systems, equipment and components— adeveloping and operating equipment to synthesise single to few layer graphene and related 2D materials, including controlling the desired structure of the materials or their properties for application; busing processes including chemical exfoliation, electrochemical exfoliation, atom or molecule intercalation, surface growth, solution phase growth, vapour deposition and large area chemical vapour deposition. 3In relation to test, inspection and production equipment— asynthesis and manufacturing routes to either or both— igraphene and related 2D; or iigraphene and related 2D materials with bespoke or optimised functional properties, including but not limited to functioning as semi-conductors; bresearch, development and production of materials at scale for use as a filler or pigment including forming or using graphene and related two-dimensional materials in dispersions or mixed with other binders; cresearch, development and production to integrate the use of materials in devices and systems; dconversion of graphene and other 2D materials into intermediaries using processes including surface treatment and functionalisation, dispersion in matrices, mechanical and laser shaping, coating and ink printing processes. 4In relation to materials, all graphene and related 2D materials, including— agraphene, hexagonal boron nitride and transition metal dichalcogenides (such as MoS2 and WS2); bgraphene and related 2D materials as thin films or coatings, powder form or mixtures with other materials; and cenergetic materials (such as propellants or explosives). 5In relation to technology— astacking of different 2D crystals resulting in either or both a charge redistribution between neighbouring crystals or causing structural changes; bcomponents with finely tuned properties made by combining different 2D materials, including stacking different 2D materials.
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(10) Nanotechnology | 1The matters are, in relation to nanotechnology, those set out in paragraphs 2 to 5. 2In relation to systems, equipment and components— asensors or detectors including quantum dots with very high sensitivity to— ichemical, biological or nuclear materials (where the threshold is close to and including single molecule levels); or iilight or other forms of radiation (where the threshold is close to and including single photon levels); bautonomous remote or remotely activated sensing and reporting systems that are enabled by nanotechnology including Smart Dust; cnanomachines or nanoscale robots either with physically moving parts or capable of physical movement. 3In relation to test, inspection and production equipment— atest, inspection or production of nanotechnology or nanomaterials but not including services only offering test and inspection requiring the prior destruction of the produced nanotechnology or nanomaterials to form a test artefact (such as using Scanning Electron Microscopy or Atomic Force Microscopy); bmethods to create or integrate nanotechnology for use in any of the following— icomputer processing or memory devices (excluding commoditised silicon microelectronics technologies); iicommunications or electronic warfare devices or components; iiiprecision navigation and timing systems; ivdetectors, sensing or imaging systems; vcounter-measure devices or systems; vimoving parts or soft robotics. 4In relation to materials, high-density nanoceramics and carbon nanotubes to reinforce ceramics for ballistic and blast protection. 5In relation to technology— atechnology that exploits nanoscale phenomena or technology that is nano-enhanced or nanoscience that further enhances nanoscale phenomena; bmaterials possessing exploitable magnetic, quantum or atomic spin states, or in combination for spinwave effects or technologies including defect centres in nanomaterials or utilising skyrmions; celectro-optic, magneto-optic, photonic or nanophotonic effects or devices (including vertical cavity emitting lasers) and circuits; dmicromechanical, nanomechanical, electromechanical, optomechanical, or electro-opto-mechanical effects or systems;
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(11) Critical materials | 1The matters are, in relation to critical materials, the extraction, refinement, processing, production and end of life recovery (in single element, compound or product form) of any the following—
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(12) Other materials | 1The matters are, in relation to other materials, those set out in paragraphs 2 to 6. 2In relation to systems, equipment and components— acapacitors based on tantalum; bcomponents used in equipment or systems for the purpose of protecting optical systems and human vision from dazzle or damage by lasers. 3In relation to test, inspection and production equipment— amachines for additively manufacturing fully-assembled robotic, soft-robotic, sub-systems and systems or autonomous robotic sub-systems, systems and vehicles but not including machines for additively manufacturing individual components for such sub-systems systems and vehicles; bcircuit board manufacturing of pitch, track or gap dimensions less than 30 micrometres; cnew component placement technologies, including multi-axis component placement; dadditive manufacturing or printing of moving parts, components and machines (known as “4D printing”); ebattery pack assembly specifically for defence and security applications at the stage of integration, not isolated battery cell construction. 4In relation to materials— amaterials (including paints or other forms of coating or surface) that are capable of modifying (including in real time) the appearance, detectability, traceability or identification of any object to a human or to sensors within the range of 15 terahertz up to and including ultraviolet; bfoams with designed electrical, electromagnetic or thermal protection properties; choneycombs with designed electrical or electromagnetic properties; dsmart materials (including micro-fluidic systems) the properties of which can be repeatedly altered once installed at rates exceeding 1 megahertz; ematerials enabling extreme size, weight and power reduction for energy, power and propulsion sources, or sensing or communications devices and systems for use in micro or smaller unmanned systems; fmaterials used in equipment or systems for the purpose of protecting optical systems and human vision from dazzle or damage from lasers. 5In relation to software and data— acreative artificial intelligence algorithms for material discovery and optimisation; bquantum simulation for material discovery and optimisation. 6In relation to technology, neuromorphic or quantum technologies enabling creative artificial intelligence or quantum simulation for materials discovery.
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