ABEC,Annular Bearing Engineers Committee, AGMA,American Gear Manufacturers’ Association, AHRS,attitude and heading reference systems, AISI,American Iron and Steel Institute, ALU,arithmetic logic unit, ANSI,American National Standards Institute, ASTM,the American Society for Testing and Materials, ATC,air traffic control, AVLIS,atomic vapour laser isotope separation, CAD,computer-aided-design, CAS,Chemical Abstracts Service, CCITT,International Telegraph and Telephone Consultative Committee, CDU,control and display unit, CEP,circular error probable, CNTD,controlled nucleation thermal deposition, CRISLA,chemical reaction by isotope selective laser activation., CVD,chemical vapour deposition, CW,chemical warfare, CW (for lasers),continuous wave, DME,distance measuring equipment, DS,directionally solidified, EB-PVD,electron beam physical vapour deposition, EBU,European Broadcasting Union, ECM,electro-chemical machining, ECR,electron cyclotron resonance, EDM,electrical discharge machines, EEPROMS,electrically erasable programmable read only memory, EIA,Electronic Industries Association, EMC,electromagnetic compatibility, ETSI,European Telecommunications Standards Institute, FFT,Fast Fourier Transform, GLONASS,global navigation satellite system, GPS,global positioning system, HBT,hetero-bipolar transistors, HDDR,high density digital recording, HEMT,high electron mobility transistors, ICAO,International Civil Aviation Organisation, IEC,International Electro-technical Commission, IEEE,Institute of Electrical and Electronic Engineers, IFOV,instantaneous-field-of-view, ILS,instrument landing system, IRIG,inter-range instrumentation group, ISA,international standard atmosphere, ISAR,inverse synthetic aperture radar, ISO,International Organisation for Standardisation, ITU,International Telecommunication Union, JIS,Japanese Industrial Standard, JT,Joule-Thomson, LIDAR,light detection and ranging, LRU,line replaceable unit, MAC,message authentication code, Mach,ratio of speed of an object to speed of sound (after Ernst Mach), MLIS,molecular laser isotopic separation, MLS,microwave landing systems, MOCVD,metal organic chemical vapour deposition, MRI,magnetic resonance imaging, MTBF,mean-time-between-failures, Mtops,million theoretical operations per second, MTTF,mean-time-to-failure, NBC,Nuclear, Biological and Chemical, NDT,non-destructive test, PAR,precision approach radar, PIN,personal identification number, ppm,parts per million, PSD,power spectral density, QAM,quadrature-amplitude-modulation, RF,radio frequency, SACMA,Suppliers of Advanced Composite Materials Association, SAR,synthetic aperture radar, SC,single crystal, SLAR,sidelooking airborne radar, SMPTE,Society of Motion Picture and Television Engineers, SRA,shop replaceable assembly, SRAM,static random access memory, SRM,SACMA Recommended Methods, SSB,single sideband, SSR,secondary surveillance radar, TCSEC,trusted computer system evaluation criteria, TIR,total indicated reading, UV,ultraviolet, UTS,ultimate tensile strength, VOR,very high frequency omni-directional range, YAG,yttrium/aluminum garnet, The numbers in parenthesis refer to the notes following this table. , A. Chemical Vapour Deposition (CVD) ,“Superalloys”,Aluminides for internal passages, Ceramics (19) and Low-expansion glasses (14), Silicides Carbides Dielectric layers (15) Diamond Diamond-like carbon (17) , Carbon-carbon, Ceramic and Metal “matrix” “composites”, Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Aluminides Alloyed aluminides (2) Boron nitride , Cemented tungsten carbide (16), Silicon carbide (18), Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) , Molybdenum and Molybdenum alloys,Dielectric layers (15), Beryllium and Beryllium alloys, Dielectric layers (15) Diamond Diamond-like carbon (17) , Sensor window materials (9), Dielectric layers (15) Diamond Diamond-like carbon (17) , B. Thermal-Evaporation Physical Vapour Deposition (TE-PVD) ,,, B.1. Physical Vapour Deposition (PVD): Electron-Beam (EB-PVD) ,“Superalloys”, Alloyed silicides Alloyed aluminides (2) MCrAlX (5) Modified zirconia (12) Silicides Aluminides Mixtures thereof (4) , Ceramics (19) and Low-expansion glasses (14),Dielectric layers (15), Corrosion resistant steel (7), MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) , Carbon-carbon, Ceramic and Metal “matrix” “composites”, Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Boron nitride , Cemented tungsten carbide (16), Silicon carbide (18), Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) , Molybdenum and Molybdenum alloys,Dielectric layers (15), Beryllium and Beryllium alloys, Dielectric layers (15) Borides Beryllium , Sensor window materials (9),Dielectric layers (15), Titanium alloys (13), Borides Nitrides , B.2. Ion assisted resistive heating Physical Vapour Deposition (PVD) (Ion Plating) ,Ceramics (19) and Low-expansion glasses (14), Dielectric layers (15) Diamond-like carbon (17) , Carbon-carbon, Ceramic and Metal “matrix” “composites”,Dielectric layers (15), Cemented tungsten carbide (16), Silicon carbide,Dielectric layers (15), Molybdenum and Molybdenum alloys,Dielectric layers (15), Beryllium and Beryllium alloys,Dielectric layers (15), Sensor window materials (9), Dielectric layers (15) Diamond-like carbon (17) , B.3. Physical Vapour Deposition (PVD): “Laser” Vaporisation ,Ceramics (19) and Low-expansion glasses (14), Silicides Dielectric layers (15) Diamond-like carbon (17) , Carbon-carbon, Ceramic and Metal “matrix” “composites”,Dielectric layers (15), Cemented tungsten carbide (16), Silicon carbide,Dielectric layers (15), Molybdenum and Molybdenum alloys,Dielectric layers (15), Beryllium and Beryllium alloys,Dielectric layers (15), Sensor window materials (9), Dielectric layers (15) Diamond-like carbon , B.4. Physical Vapour Deposition (PVD): Cathodic Arc Discharge ,“Superalloys”, Alloyed silicides Alloyed aluminides (2) MCrAlX (5) , Polymers (11) and Organic “matrix” “composites”, Borides Carbides Nitrides Diamond-like carbon (17) , C. Pack cementation (see A above for out-of-pack cementation) (10) ,Carbon-carbon, Ceramic and Metal “matrix” “composites”, Silicides Carbides Mixtures thereof (4) , Titanium alloys (13), Silicides Aluminides Alloyed aluminides (2) , Refractory metals and alloys (8), Silicides Oxides , D. Plasma spraying ,“Superalloys”, MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) Abradable Nickel-Graphite Abradable materials containing Ni-Cr-Al Abradable Al-Si-Polyester Alloyed aluminides (2) , Aluminium alloys (6), MCrAlX (5) Modified zirconia (12) Silicides Mixtures thereof (4) , Refractory metals and alloys (8), Aluminides Silicides Carbides , Corrosion resistant steel (7), MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) , Titanium alloys (13), Carbides Aluminides Silicides Alloyed aluminides (2) Abradable Nickel-Graphite Abradable materials containing Ni-Cr-Al Abradable Al-Si-Polyester , E. Slurry Deposition ,Refractory metals and alloys (8), Fused silicides Fused aluminides except for resistance heating elements , Carbon-carbon, Ceramic and Metal “matrix” “composites”, Silicides Carbides Mixtures thereof (4) , F. Sputter Deposition ,“Superalloys”, Alloyed silicides Alloyed aluminides (2) Noble metal modified aluminides (3) MCrAlX (5) Modified zirconia (12) Platinum Mixtures thereof (4) , Ceramics and Low-expansion glasses (14), Silicides Platinum Mixtures thereof (4) Dielectic layers (15) Diamond-like carbon (17) , Titanium alloys (13), Borides Nitrides Oxides Silicides Aluminides Alloyed aluminides (2) Carbides , Carbon-carbon, Ceramic and Metal “matrix” “composites”, Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Boron nitride , Cemented tungsten carbide (16), Silicon carbide (18), Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) Boron nitride , Molybdenum and Molybdenum alloys,Dielectric layers (15), Beryllium and Beryllium alloys, Borides Dielectric layers (15) Beryllium , Sensor window materials (9), Dielectric layers (15) Diamond-like carbon (17) , Refractory metals and alloys (8), Aluminides Silicides Oxides Carbides , G. Ion Implantation ,High temperature bearing steels,Additions of Chromium Tantalum or Niobium (Columbium), Titanium alloys (13), Borides Nitrides , Beryllium and Beryllium alloys,Borides, Cemented tungsten carbide (16), Carbides Nitrides ,